The USB 3.0 specification took an important step towards wider implementation with the certification of the first SuperSpeed USB 3.0 chipsets, the A75 and A70M FCH chipsets from Advanced Micro Devices, the USB Implementers Forum (USB-IF) announced Tuesday.
"The ramp of the SuperSpeed USB ecosystem has been unprecedented, and the first certified SuperSpeed USB chipsets from AMD are a momentous step in the industry," USB-IF president Jeff Ravencraft said in a statement.
"SuperSpeed USB integration into the chipsets is a strong incentive for manufacturers to bring an even broader range of SuperSpeed USB solutions to the market."
The USB specification for establishing communication between peripheral devices like flash drives and a PC, smartphone or other host controller has largely replaced older interfaces like serial and parallel ports.
The USB 3.0 specification was completed in November 2008 and the first consumer USB 3.0 products were released by Buffalo Technology a year later. The first certified USB 3.0 products, including motherboards from ASUS and Gigabyte, were announced at the 2010 Consumer Electronics Show in Las Vegas.
A key new feature in the USB 3.0 specification is the "SuperSpeed" bus, which adds a fourth transfer mode to enable much faster transfers of data from peripheral devices to host controllers.
"The integration of SuperSpeed USB into AMD's Fusion Controller Hubs demonstrates AMD's commitment to providing the industry's latest, most innovative connectivity technologies," said Chris Cloran, corporate vice-president and general manager of AMD's Client Group.
"AMD Fusion Controller Hubs will provide competitive performance while consuming low power with active USB 3.0 traffic for high definition video and fast connectivity with the latest SuperSpeed USB devices."
AMD rival Intel has its own proprietary I/0 technology called Thunderbolt.
Source:PC Mag
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